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ABI Electronics

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Introducing SENTRY Counterfeit IC Detector

What are Counterfeit Devices

The manufacture of counterfeit (or fake) components is an illegal process that emerged due to the transferable value of electronic parts. Any company requiring components to manufacture PCBs is at risk and many have already received batches of “bad” devices. Counterfeiting can be achieved through various processes, including removing devices from scrap boards, then superficially repairing and rebranding or using normal manufacturing capabilities in “ghost shifts” outside of standard hours, which may have several manufacturing faults (some may not even contain a silicon die). Differentiating counterfeit components is usually expensive and time-consuming. Waiting for devices to be tested on a PCB is dangerous and might lead to the recall of entire batches.

Protect Your Supply Chain

Stay ahead of counterfeiting and non-conforming components entering your supply chain with SENTRY. This easy-to-use tester is the quickest solution on the market for identifying rogue devices and mitigating risks. Using unique electrical signature (PinPrint) comparison, it determines authenticity against a customisable library of good working examples.

Requiring no previous knowledge of electronics, it can test from simple 2-pin devices to complex BGA packages. Easily detect missing or incorrect dies, lack of bond wires, inaccurate pinouts and pin impedance variations. Generate reports in minutes that combine technical data with web links, PDFs and images. SENTRY is designed with data sharing in mind, meaning PinPrints can be shared from the OEM through to the distributor and end user.

Adaptable to All Devices

Fully Custom Library

Little Training Required

Full Report Analysis

Available Accessories

Universal PLCC Adapters

Designed to accomodate a range of PLCC package & pin sizes (up to 84 pins) whilst keeping adapters to a minimum. 

  • Plastic: Parts black UL 94 V-0 Glass-filled Polyphenylene Sulfide (PPS)
  • Contact Pin: heat-treated Beryllium-Copper alloy 172
  • Contact Plating: 12µ [0.31µm] min. Gold per MIL-G-45204 over 100µ [2.54µ] min. Nickel per SAE-AMS-QQ-N-290 over 20µ [0.51µ] Copper per MIL-C-14550
  • Hardware: Stainless Steel
    Operating Temperature: 85°F to 257°F [-65°C to 125°C]
  • Life Cycle: 10,000 insertions maximum

Universal SOIC Adapters

Designed to accommodate a range of SOIC package & pin sizes (up to 44 pins) whilst keeping adapters to a minimum. 

  • Loosen Locator Lock Screws
  • Slide one of the Locators to a position that would place the device to be tested centrally on the contacts and tighten its Lock Screw
  • Slide the Second Locator Lock Screw (clearance is required for ease-of-loading and removal)
  • Remove screw for Hinge Plate
  • Swing Hinge Plate up out of socket top
  • Loosen Pressure Plate Locking Screws and slide them out
  • Position Pressure Plates so they will press down on the feet (part of Pb that gets soldered to board) of a Gull Wing device (see Detail “A”). If the device has J-leads, position Pressure Plates to press down on top of device’s body (see Detail “B”) and tighten locking screws.
  • Swing Hinge Plate back into the socket top and tighten the Screw for the Hinge Plate
  • Double check your settings

Customisable Test Adapters

ABI  offers a range of customisable options for adapters, from board design and layout to complete adapter assembly.

  • BGA Adapter 292 pins, 1.27mm pitch
  • BGA Adapter 256 pins, 1.00mm pitch
  • BGA Adapter 456 pins, 1.00mm pitch
  • QFP Adapter 100 pins, 0.65mm pitch
  • BGA Adapter 48 pins (6×8), 0.75mm pitch
  • QFP Adapter 100 pins (25×25), 0.5mm pitch
  • QFP Adapter 208 pins (52×52), 0.5mm pitch
  • Dual Adapter 54 pins TSOP (0.8mm pitch) with 64 pins QFP (16×16) 0.5mm pitch

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